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The microstructural aspect of the ductile-to-brittle transition of Tin-based lead-free solders

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dc.contributor.authorLambrinou, Konstantza
dc.contributor.authorEngelmaier, Werner
dc.date.accessioned2021-10-18T17:56:15Z
dc.date.available2021-10-18T17:56:15Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17425
dc.source.beginpageJAI103064
dc.source.issue7
dc.source.journalJournal of ASTM International
dc.source.volume7
dc.title

The microstructural aspect of the ductile-to-brittle transition of Tin-based lead-free solders

dc.typeJournal article
dspace.entity.typePublication
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