Publication:

Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board

Date

2018-04
Proceedings Paper
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dc.contributor.authorNawghane, Chinmay
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorAllaert, Bart
dc.contributor.authorLauwaert, Ralf
dc.contributor.authorVanhee, Filip
dc.contributor.authorPissoort, Davy
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMehner, Jan
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-26T00:01:01Z
dc.date.available2021-10-26T00:01:01Z
dc.date.embargo9999-12-31
dc.date.issued2018-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31403
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8369950
dc.source.beginpage1
dc.source.conference19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE
dc.source.conferencedate16/04/2018
dc.source.conferencelocationToulouse France
dc.source.endpage8
dc.title

Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board

dc.typeProceedings paper
dspace.entity.typePublication
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