Influence of plating conditions on the dynamics of copper grain growth during thermal annealing

dc.contributor.author	Brongersma, Sywert
dc.contributor.author	D'Haen, Jan
dc.contributor.author	Vanstreels, Kris
dc.contributor.author	De Ceuninck, Ward
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Brongersma, Sywert
dc.contributor.imecauthor	D'Haen, Jan
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	De Ceuninck, Ward
dc.contributor.imecauthor	Maex, Karen
dc.contributor.orcidimec	Brongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned	2021-10-15T04:04:22Z
dc.date.available	2021-10-15T04:04:22Z
dc.date.issued	2003
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/7260
dc.source.conference	MRS Spring Meeting Symposium E: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics
dc.source.conferencedate	21/04/2003
dc.source.conferencelocation	San Francisco, CA USA
dc.title	Influence of plating conditions on the dynamics of copper grain growth during thermal annealing
dc.type	Oral presentation
dspace.entity.type	Publication
Files
Publication available in collections:	Presentations