Publication:
Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology
| dc.contributor.author | Van Huylenbroeck, Stefaan | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Teugels, Lieve | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | Fodor, Ferenc | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Teugels, Lieve | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | Fodor, Ferenc | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2022-03-16T14:44:44Z | |
| dc.date.available | 2022-03-16T14:44:44Z | |
| dc.date.issued | 2021 | |
| dc.identifier.doi | 10.1109/ECTC32696.2021.00173 | |
| dc.identifier.eisbn | 978-0-7381-4523-5 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/39458 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1057 | |
| dc.source.conference | IEEE 71st Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 01-JUL 04, 2021 | |
| dc.source.conferencelocation | Virtual | |
| dc.source.endpage | 1062 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 6 | |
| dc.title | Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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