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Electroless deposition on self-assembled monolayers as a method to enable fabrication of advanced interconnects

Date

2013
Meeting abstract
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dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorChebiam, Ramanan V.
dc.contributor.authorTeugels, Lieve
dc.contributor.authorClendenning, Scott
dc.contributor.authorClarke, Jim
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.date.accessioned2021-10-21T09:40:23Z
dc.date.available2021-10-21T09:40:23Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22742
dc.identifier.urlhttps://ecs.confex.com/ecs/224/webprogram/Paper23158.html
dc.source.beginpage2368
dc.source.conference224th ECS Fall Meeting
dc.source.conferencedate27/10/2013
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Electroless deposition on self-assembled monolayers as a method to enable fabrication of advanced interconnects

dc.typeMeeting abstract
dspace.entity.typePublication
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