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CTE measurements for 3D package substrates using digital image correlation
Publication:
CTE measurements for 3D package substrates using digital image correlation
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Date
2016
Proceedings Paper
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32878.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Salahouelhadj, Abdellah
;
Gonzalez, Mario
Journal
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1942
since deposited on 2021-10-23
Acq. date: 2026-01-10
Citations
Metrics
Views
1942
since deposited on 2021-10-23
Acq. date: 2026-01-10
Citations