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Conference contributions
BGA solder strain prediction using an Artificial Neural Network regressor
Publication:
BGA solder strain prediction using an Artificial Neural Network regressor
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Date
2022
Proceedings Paper
https://doi.org/10.1109/EuroSimE54907.2022.9758918
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2.87 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ferrando Villalba, Pablo
;
Vandevelde, Bart
Journal
na
Abstract
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1129
since deposited on 2023-06-20
Acq. date: 2025-12-15
Citations
Metrics
Views
1129
since deposited on 2023-06-20
Acq. date: 2025-12-15
Citations