Publication:

Simulation of Cu pumping during TSV fabrication

Date

2013
Proceedings Paper
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dc.contributor.authorNabiollahi, Nabi
dc.contributor.authorWilson, Chris
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-21T10:18:09Z
dc.date.available2021-10-21T10:18:09Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22840
dc.source.conferenceIEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE
dc.source.conferencedate14/04/2013
dc.source.conferencelocationWroclaw Poland
dc.title

Simulation of Cu pumping during TSV fabrication

dc.typeProceedings paper
dspace.entity.typePublication
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