Publication:

Quantitive endurance failure model for filamentary RRAM

Date

2015
Proceedings Paper
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dc.contributor.authorDegraeve, Robin
dc.contributor.authorFantini, Andrea
dc.contributor.authorRoussel, Philippe
dc.contributor.authorGoux, Ludovic
dc.contributor.authorCostantino, A.
dc.contributor.authorChen, Michael
dc.contributor.authorClima, Sergiu
dc.contributor.authorGovoreanu, Bogdan
dc.contributor.authorLinten, Dimitri
dc.contributor.authorThean, Aaron
dc.contributor.authorJurczak, Gosia
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorFantini, Andrea
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorClima, Sergiu
dc.contributor.imecauthorGovoreanu, Bogdan
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorThean, Aaron
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecClima, Sergiu::0000-0002-4044-9975
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.date.accessioned2021-10-22T18:55:47Z
dc.date.available2021-10-22T18:55:47Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25172
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7223673
dc.source.beginpage188
dc.source.conferenceIEEE Symposium on VLSI Technology
dc.source.conferencedate15/06/2015
dc.source.conferencelocationKyoto Japan
dc.source.endpage189
dc.title

Quantitive endurance failure model for filamentary RRAM

dc.typeProceedings paper
dspace.entity.typePublication
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