Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using oxygen-free fluorocarbon plasma

dc.contributor.author	Mannaert, Geert
dc.contributor.author	Baklanov, Mikhaïl
dc.contributor.author	Le, Quoc Toan
dc.contributor.author	Travaly, Youssef
dc.contributor.author	Boullart, Werner
dc.contributor.author	Vanhaelemeersch, Serge
dc.contributor.author	Jonas, A.M.
dc.contributor.imecauthor	Mannaert, Geert
dc.contributor.imecauthor	Le, Quoc Toan
dc.contributor.imecauthor	Boullart, Werner
dc.contributor.imecauthor	Vanhaelemeersch, Serge
dc.contributor.orcidimec	Le, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimec	Boullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimec	Vanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned	2021-10-16T03:14:30Z
dc.date.available	2021-10-16T03:14:30Z
dc.date.issued	2005
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/10844
dc.source.beginpage	2198
dc.source.endpage	2202
dc.source.issue	5
dc.source.journal	Journal of Vacuum Science and Technology B
dc.source.volume	23
dc.title	Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using oxygen-free fluorocarbon plasma
dc.type	Journal article
dspace.entity.type	Publication
Files
Publication available in collections:	Articles

Date