Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Test structures for characterization of through-silicon vias
Publication:
Test structures for characterization of through-silicon vias
Copy permalink
Date
2012
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
22412.pdf
8.66 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stucchi, Michele
;
Perry, Daniel
;
Katti, Guruprasad
;
Dehaene, Wim
;
Velenis, Dimitrios
Journal
IEEE Transactions on Semiconductor Manufacturing
Abstract
Description
Metrics
Views
1894
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1894
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-10
Citations