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Investigation of die-cost scaling scenarios in future technologies

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dc.contributor.authorMirabelli, Gioele
dc.contributor.authorTsai, Y.-P.
dc.contributor.authorChang, Y.-H.
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorKim, Ryan Ryoung Han
dc.contributor.authorMyers, James
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorZografos, Odysseas
dc.contributor.authorHellings, Geert
dc.contributor.imecauthorMirabelli, G.
dc.contributor.imecauthorTsai, Y. -P.
dc.contributor.imecauthorChang, Y. -H.
dc.contributor.imecauthorVelenis, D.
dc.contributor.imecauthorKim, R. -H.
dc.contributor.imecauthorMyers, J.
dc.contributor.imecauthorRagnarsson, L. -A.
dc.contributor.imecauthorZografos, O.
dc.contributor.imecauthorHellings, G.
dc.date.accessioned2024-06-15T17:25:02Z
dc.date.available2024-06-15T17:25:02Z
dc.date.issued2024
dc.identifier.doi10.1117/12.3010149
dc.identifier.eisbn978-1-5106-7215-4
dc.identifier.isbn978-1-5106-7214-7
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44030
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage129540E
dc.source.conferenceConference on DTCO and Computational Patterning III
dc.source.conferencedate2024-02-25
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.numberofpages7
dc.title

Investigation of die-cost scaling scenarios in future technologies

dc.typeProceedings paper
dspace.entity.typePublication
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