Publication:

3D interconnects for quantum computing

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00132
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dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDangol, Anish
dc.contributor.authorHussain, Tassawar
dc.contributor.authorStegmann, Heiko
dc.contributor.authorAnanthapadmanabha Rao, Vadiraj
dc.contributor.authorDhakras, Prathamesh
dc.contributor.authorWitters, Thomas
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorMudigere Krishne Gowda, Punith
dc.contributor.authorGerets, Carine
dc.contributor.authorRadisic, Alex
dc.contributor.authorVaquilar, Aldrin
dc.contributor.authorGoehnermeier, Aksel
dc.contributor.authorWan, Danny
dc.contributor.authorMiller, Andy
dc.contributor.authorJourdain, Anne
dc.contributor.authorCherman, Vladimir
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Greve, Kristiaan
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDangol, Anish
dc.contributor.imecauthorHussain, Tassawar
dc.contributor.imecauthorDhakras, Prathamesh
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorVaquilar, Aldrin
dc.contributor.imecauthorWan, Danny
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Greve, Kristiaan
dc.contributor.imecauthorAnanthapadmanabha Rao, Vadiraj
dc.contributor.imecauthorMudigere Krishne Gowda, Punith
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDangol, Anish::0009-0005-8897-1534
dc.contributor.orcidimecHussain, Tassawar::0000-0002-8916-7135
dc.contributor.orcidimecDhakras, Prathamesh::0000-0003-4527-0533
dc.contributor.orcidimecWitters, Thomas::0000-0002-8528-9469
dc.contributor.orcidimecShafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimecGerets, Carine::0009-0007-2069-6032
dc.contributor.orcidimecVaquilar, Aldrin::0000-0001-9343-8906
dc.contributor.orcidimecWan, Danny::0000-0003-4847-3184
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Greve, Kristiaan::0000-0002-1314-9715
dc.contributor.orcidimecAnanthapadmanabha Rao, Vadiraj::0000-0001-8676-5044
dc.contributor.orcidimecMudigere Krishne Gowda, Punith::0000-0003-4042-0942
dc.contributor.orcidimecRadisic, Alex::0000-0002-6699-1615
dc.date.accessioned2025-02-11T10:52:16Z
dc.date.available2024-12-07T16:57:34Z
dc.date.available2025-02-11T10:52:16Z
dc.date.issued2024
dc.description.wosFundingTextand Imec industrial affiliation program (IIAP) partners for their contributions and Imec P-line and 3D bonding and assembly team for supporting all the processes. This project was partially supported by MATQu funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union's Horizon 2020 research and innovation program.
dc.identifier.doi10.1109/ECTC51529.2024.00132
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44945
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage821
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage828
dc.source.journalN/A
dc.source.numberofpages8
dc.title

3D interconnects for quantum computing

dc.typeProceedings paper
dspace.entity.typePublication
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