Publication:

Substrate Integrated Coaxial Line Millimeterwave Components Manufactured in Standard PCB

 
dc.contributor.authorVan Messem, Laura
dc.contributor.authorMoerman, Arno
dc.contributor.authorCaytan, Olivier
dc.contributor.authorRogier, Hendrik
dc.contributor.authorLemey, Sam
dc.contributor.imecauthorVan Messem, Laura
dc.contributor.imecauthorMoerman, Arno
dc.contributor.imecauthorCaytan, Olivier
dc.contributor.imecauthorRogier, Hendrik
dc.contributor.imecauthorLemey, Sam
dc.contributor.orcidimecVan Messem, Laura::0000-0003-3845-9397
dc.contributor.orcidimecMoerman, Arno::0000-0003-0945-2786
dc.contributor.orcidimecCaytan, Olivier::0000-0002-1524-971X
dc.contributor.orcidimecRogier, Hendrik::0000-0001-8139-2736
dc.contributor.orcidimecLemey, Sam::0000-0003-1366-2604
dc.date.accessioned2024-05-06T15:03:42Z
dc.date.available2023-12-29T17:25:19Z
dc.date.available2024-01-09T10:09:24Z
dc.date.available2024-05-06T15:03:42Z
dc.date.embargo2023-10-31
dc.date.issued2023
dc.identifier.doi10.1109/EPEPS58208.2023.10314860
dc.identifier.eisbn979-8-3503-1798-5
dc.identifier.issn2165-4107
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43316
dc.publisherIEEE
dc.source.conferenceIEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
dc.source.conferencedateOCT 15-18, 2023
dc.source.conferencelocationMilpitas
dc.source.journal/
dc.source.numberofpages3
dc.title

Substrate Integrated Coaxial Line Millimeterwave Components Manufactured in Standard PCB

dc.typeProceedings paper
dspace.entity.typePublication
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