Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
3D stacking using ultra thin dies
Publication:
3D stacking using ultra thin dies
Copy permalink
Date
2012
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
24488.pdf
550.65 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
La Manna, Antonio
;
Velenis, Dimitrios
;
Buisson, Thibault
;
Detalle, Mikael
;
Rebibis, Kenneth June
;
Zhang, Wenqi
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1975
since deposited on 2021-10-20
Acq. date: 2025-12-11
Citations
Metrics
Views
1975
since deposited on 2021-10-20
Acq. date: 2025-12-11
Citations