Publication:

Enabling backside processing for perforated microfluidic devices

Date

2023
Proceedings Paper
https://doi.org/10.1109/ECTC51909.2023.00216
Simple item page Full metadata Statistics
 
dc.contributor.authorVisker, Jakob
dc.contributor.authorHan, Yang
dc.contributor.authorVisker, Evert
dc.contributor.authorDang Thi Thuy, Chi
dc.contributor.authorGocyla, Mateusz
dc.contributor.authorHumbert, Aurelie
dc.contributor.authorAckaert, Jan
dc.contributor.authorPeng, Lan
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorHan, Yang
dc.contributor.imecauthorVisker, Evert
dc.contributor.imecauthorGocyla, Mateusz
dc.contributor.imecauthorHumbert, Aurelie
dc.contributor.imecauthorAckaert, Jan
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorDang Thi Thuy, Chi
dc.contributor.orcidimecHan, Yang::0009-0007-5606-6817
dc.contributor.orcidimecVisker, Evert::0000-0002-1096-9670
dc.contributor.orcidimecHumbert, Aurelie::0000-0002-2538-8991
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2023-12-18T11:28:27Z
dc.date.available2023-10-23T17:27:27Z
dc.date.available2023-12-18T11:28:27Z
dc.date.issued2023
dc.identifier.doi10.1109/ECTC51909.2023.00216
dc.identifier.eisbn979-8-3503-3498-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42911
dc.publisherIEEE
dc.source.beginpage1266
dc.source.conferenceIEEE 73rd Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 30-JUN 02, 2023
dc.source.conferencelocationOrlando
dc.source.endpage1272
dc.source.journalna
dc.source.numberofpages7
dc.title

Enabling backside processing for perforated microfluidic devices

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions