Publication:
Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits
Date
| dc.contributor.author | van der Sluis, Olaf | |
| dc.contributor.author | Hsu, Yung-Yu | |
| dc.contributor.author | Timmermans, P.H.M. | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Hoefnagels, J.P.M. | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.date.accessioned | 2021-10-18T22:59:06Z | |
| dc.date.available | 2021-10-18T22:59:06Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18170 | |
| dc.source.conference | 18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale | |
| dc.source.conferencedate | 30/08/2010 | |
| dc.source.conferencelocation | Dresden Germany | |
| dc.title | Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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