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Conference contributions
3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
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3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
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Date
2015
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maggioni, Federica
;
Oprins, Herman
;
Milojevic, Dragomir
;
Beyne, Eric
;
De Wolf, Ingrid
;
Baelmans, Martine
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1975
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-10
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Metrics
Views
1975
since deposited on 2021-10-22
2
last month
Acq. date: 2025-12-10
Citations