Publication:

The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects

Date

2009
Proceedings Paper
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dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorStruyf, Herbert
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorHeylen, Nancy
dc.contributor.authorRichard, Olivier
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.accessioned2021-10-18T01:26:36Z
dc.date.available2021-10-18T01:26:36Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15971
dc.source.beginpage733
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC 2008)
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage737
dc.title

The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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