Publication:
Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T16:37:31Z | |
| dc.date.available | 2021-10-14T16:37:31Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5064 | |
| dc.source.beginpage | S23 | |
| dc.source.conference | IEDM Technical Digest; 2-5 December 2001; Washington, D.C., USA. | |
| dc.source.conferencelocation | ||
| dc.source.endpage | 3 | |
| dc.title | Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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