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3D Interconnect technology for space applications
Publication:
3D Interconnect technology for space applications
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Date
2005
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Moor, Piet
;
De Munck, Koen
;
Sabuncuoglu Tezcan, Deniz
;
Baert, Kris
;
Beyne, Eric
;
Van Hoof, Chris
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1984
since deposited on 2021-10-16
Acq. date: 2025-12-11
Citations
Metrics
Views
1984
since deposited on 2021-10-16
Acq. date: 2025-12-11
Citations