Publication:

2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms

Date

2014
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorAgrawal, Prashant
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorCatthoor, Francky
dc.contributor.authorVan der Perre, Liesbet
dc.contributor.authorBeyne, Eric
dc.contributor.authorVaradarajan, Ravi
dc.contributor.imecauthorAgrawal, Prashant
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T00:43:16Z
dc.date.available2021-10-22T00:43:16Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23478
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6831839&queryText%3D2D+vs+3D+integration%3A+Architecture-technolo
dc.source.beginpage381
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate20/05/2014
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage384
dc.title

2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
29224.pdf
Size:
723.09 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions