Publication:
Real-Time MOSFET Condition Monitoring for Variable Mission Profiles With a Dual Extended Kalman Filter
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-9221-4932 | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtualsource.department | 6135dbc2-f1c6-4a89-ab31-0608a53994c6 | |
| cris.virtualsource.department | 5d22889d-a568-4860-af79-f9efe51000b4 | |
| cris.virtualsource.orcid | 6135dbc2-f1c6-4a89-ab31-0608a53994c6 | |
| cris.virtualsource.orcid | 5d22889d-a568-4860-af79-f9efe51000b4 | |
| dc.contributor.author | Deckers, Martijn | |
| dc.contributor.author | Van Cappellen, Leander | |
| dc.contributor.author | Moschner, Jens | |
| dc.contributor.author | Daenen, Michaël | |
| dc.contributor.author | Driesen, Johan | |
| dc.contributor.imecauthor | Van Cappellen, Leander | |
| dc.contributor.imecauthor | Daenen, Michael | |
| dc.date.accessioned | 2024-12-31T16:56:43Z | |
| dc.date.available | 2024-12-31T16:56:43Z | |
| dc.date.issued | 2025 | |
| dc.description.abstract | The article proposes a methodology to detect real-time power mosfet degradation, in variable mission profile applications, using externally measurable electrical parameters. This complements the work done for fixed operation conditions in current literature. To achieve this, the damage and temperature sensitive drain to source resistance is accompanied with a gate resistance measurement only sensitive to temperature. Together, they allow for the detection of, and the distinction between, bond wire and die attach solder layer degradation. A dual extended Kalman filter is used to filter the measurement data and to estimate the change in thermal model. The article shows the measurement circuits together with proof of concept lab results in a solar photovoltaic use case. The main aim is to show that the resistance measurement can be compensated for mission profile temperature variations and that the thermal resistance can be estimated, reflecting bond wire and die attach solder layer degradation. | |
| dc.description.wosFundingText | This work was supported by the Flanders Innovation & Entrepreneurship and Flux50 under project DAPPER under Grant HBC.2020.2144. The work of Martijn Deckers was supported by a Ph.D. grant from the Research Foundation Flanders (FWO) under Grant 1S87522N.Recommended for publication by Associate Editor H. Luo. | |
| dc.identifier.doi | 10.1109/TPEL.2024.3480704 | |
| dc.identifier.issn | 0885-8993 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45028 | |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
| dc.source.beginpage | 2219 | |
| dc.source.endpage | 2234 | |
| dc.source.issue | 1 | |
| dc.source.journal | IEEE TRANSACTIONS ON POWER ELECTRONICS | |
| dc.source.numberofpages | 16 | |
| dc.source.volume | 40 | |
| dc.subject.keywords | POWER | |
| dc.subject.keywords | TEMPERATURE | |
| dc.subject.keywords | FAILURE | |
| dc.subject.keywords | MODULES | |
| dc.title | Real-Time MOSFET Condition Monitoring for Variable Mission Profiles With a Dual Extended Kalman Filter | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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