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3D technology enabling innovative smart system integration

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dc.contributor.authorBeyne, Eric
dc.contributor.authorZhang, Wenqi
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T12:35:42Z
dc.date.available2021-10-19T12:35:42Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18580
dc.source.conferenceChina International Semiconductor Technology Conference - CISTC
dc.source.conferencedate13/03/2011
dc.source.conferencelocationShanghai PRC
dc.title

3D technology enabling innovative smart system integration

dc.typeOral presentation
dspace.entity.typePublication
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