Publication:

Electromigration in Nano-Interconnects: Determining Reliability Margins in Redundant Mesh Networks Using a Scalable Physical-Statistical Hybrid Paradigm

Date

2024
Journal article
https://doi.org/10.3390/mi15080956
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dc.contributor.authorZahedmanesh, Houman
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.date.accessioned2025-01-21T11:39:27Z
dc.date.available2024-09-17T17:59:59Z
dc.date.available2025-01-21T11:39:27Z
dc.date.embargo2024-07-26
dc.date.issued2024
dc.identifier.doi10.3390/mi15080956
dc.identifier.issn2072-666X
dc.identifier.pmidMEDLINE:39203607
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44513
dc.publisherMDPI
dc.source.beginpageArt. 956
dc.source.endpageN/A
dc.source.issue8
dc.source.journalMICROMACHINES
dc.source.numberofpages23
dc.source.volume15
dc.subject.keywordsCOPPER INTERCONNECT
dc.subject.keywordsSTRESS EVOLUTION
dc.subject.keywordsVOID NUCLEATION
dc.subject.keywordsMODEL
dc.subject.keywordsMICROSTRUCTURE
dc.subject.keywordsFILMS
dc.title

Electromigration in Nano-Interconnects: Determining Reliability Margins in Redundant Mesh Networks Using a Scalable Physical-Statistical Hybrid Paradigm

dc.typeJournal article
dspace.entity.typePublication
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