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On the Channel and Wafer Orientation Dependence in Unstrained and Strained <i>p</i>-Type Nanosheets

 
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dc.contributor.authorBufler, Fabian
dc.contributor.authorEneman, Geert
dc.contributor.authorMatagne, Philippe
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorHellings, Geert
dc.date.accessioned2026-09-14T10:58:53Z
dc.date.available2026-09-14T10:58:53Z
dc.date.createdwos2026
dc.date.issued2025
dc.description.abstractThe performance dependence on wafer and channel orientation in nanosheet pFETs with a sheet width of WNS=12nm and a sheet thickness of tNS=5 nm is investigated by Monte Carlo (MC) device simulation. It is shown that (a) the influence of the sidewall changes the orientation dependence of the longchannel mobility in planar bulk pMOSFETs and (b) that this orientation dependence further changes in short-channel devices with (110)/⟨100⟩ having the hightest on-current in the absence of stress. The strongest performance is obtained for uniaxial compressive stress in ⟨111⟩ channel direction, while high uniaxial tensile stress in ⟨100⟩ direction enables only a modest gain.
dc.identifier.doi10.1109/sispad66650.2025.11186385
dc.identifier.isbn979-8-3315-4884-1
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60334
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.beginpage1
dc.source.conferenceInternational Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
dc.source.conferencedate2025-09-24
dc.source.conferencelocationGrenoble
dc.source.endpage4
dc.source.journal2025 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPAD
dc.source.numberofpages4
dc.subject.keywordsMOSFETS
dc.subject.keywordsALLOYS
dc.title

On the Channel and Wafer Orientation Dependence in Unstrained and Strained p-Type Nanosheets

dc.typeProceedings paper
dspace.entity.typePublication
imec.identified.statusLibrary
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-09-13
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