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Impact of Sub-mu m Wafer Thinning on Latch-up Risk in STCO Scaling Era
Publication:
Impact of Sub-mu m Wafer Thinning on Latch-up Risk in STCO Scaling Era
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Date
2021
Proceedings Paper
https://doi.org/10.23919/EOS/ESD52038.2021.9574787
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Serbulova, Kateryna
;
Chen, Shih-Hung
;
Hellings, Geert
;
Hiblot, Gaspard
;
Veloso, Anabela
;
Jourdain, Anne
;
De Boeck, Jo
;
Groeseneken, Guido
;
Horiguchi, Naoto
Journal
43rd Annual EOS/ESD Symposium (EOS/ESD) Proceedings
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1132
since deposited on 2023-06-20
1
last month
Acq. date: 2025-12-15
Citations