Publication:
Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafers
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1885 since deposited on 2021-09-29
3last month
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Acq. date: 2025-12-17
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Views
1885 since deposited on 2021-09-29
3last month
1last week
Acq. date: 2025-12-17
Citations