Publication:

3.5T CFET Block-Level DTCO for Superior PPA in A7 Node by Split Power, hDR Cells, Optimized Pins and BEOL

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-6844-309X
cris.virtual.orcid0000-0002-9998-8009
cris.virtual.orcid0000-0001-5490-0416
cris.virtual.orcid0000-0002-8055-2993
cris.virtual.orcid0000-0002-2941-769X
cris.virtual.orcid0000-0002-8761-5213
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0001-9119-6069
cris.virtual.orcid0009-0005-2235-2503
cris.virtual.orcid0000-0001-5772-5406
cris.virtual.orcid0000-0002-5376-2119
cris.virtual.orcid0000-0001-9179-6443
cris.virtual.orcid0000-0002-0658-5316
cris.virtualsource.departmentf0cc4324-3078-40e8-aa77-a7aee58bc80c
cris.virtualsource.department9d79c6fb-8d31-4942-9cf4-f2da02aba2a1
cris.virtualsource.department9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.department549c89dd-95c0-4f89-b58d-2a0404d55cab
cris.virtualsource.departmentfeba3b8f-9412-41d5-af83-b31804e5daa2
cris.virtualsource.department385e9959-f3a2-4f98-af98-96c32b2bc006
cris.virtualsource.departmented894ec9-d595-4dd3-943b-8d99244a104d
cris.virtualsource.departmenta74a0cad-0541-4fe7-b195-314c38501e7e
cris.virtualsource.department62d6480e-b6dd-4ce9-a836-5bae2a50f899
cris.virtualsource.department3390eb9c-7227-4d66-9355-35d95810883a
cris.virtualsource.departmentcd811942-aea0-4312-8eb5-d9cc179a6b3d
cris.virtualsource.department9423ea63-d2bb-4974-b0c7-6723385dceb6
cris.virtualsource.departmenta1961df9-c56b-4c7c-a23b-440639c60997
cris.virtualsource.orcidf0cc4324-3078-40e8-aa77-a7aee58bc80c
cris.virtualsource.orcid9d79c6fb-8d31-4942-9cf4-f2da02aba2a1
cris.virtualsource.orcid9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.orcid549c89dd-95c0-4f89-b58d-2a0404d55cab
cris.virtualsource.orcidfeba3b8f-9412-41d5-af83-b31804e5daa2
cris.virtualsource.orcid385e9959-f3a2-4f98-af98-96c32b2bc006
cris.virtualsource.orcided894ec9-d595-4dd3-943b-8d99244a104d
cris.virtualsource.orcida74a0cad-0541-4fe7-b195-314c38501e7e
cris.virtualsource.orcid62d6480e-b6dd-4ce9-a836-5bae2a50f899
cris.virtualsource.orcid3390eb9c-7227-4d66-9355-35d95810883a
cris.virtualsource.orcidcd811942-aea0-4312-8eb5-d9cc179a6b3d
cris.virtualsource.orcid9423ea63-d2bb-4974-b0c7-6723385dceb6
cris.virtualsource.orcida1961df9-c56b-4c7c-a23b-440639c60997
dc.contributor.authorLin, Ji-Yung
dc.contributor.authorKükner, Halil
dc.contributor.authorYang, Sheng
dc.contributor.authorVerschueren, Lynn
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorDell Atti, Francesco
dc.contributor.authorFarokhnejad, Anita
dc.contributor.authorVan de Put, Maarten
dc.contributor.authorZografos, Odysseas
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorGarcia Bardon, Marie
dc.contributor.authorHellings, Geert
dc.contributor.authorRyckaert, Julien
dc.date.accessioned2026-07-15T14:05:01Z
dc.date.available2026-07-15T14:05:01Z
dc.date.createdwos2026
dc.date.issued2025
dc.description.abstractComplementary FETs (CFET), with the structure of stacked n-/p-FETs, hold promises for continuing shrinking device footprints after the nanosheet era. To realize CFET block-level designs with superior power-performance-area (PPA), several enhancements are introduced through design technology co-optimization (DTCO), such as a double-row split-power CFET structure, half-height double-row cells, as well as optimization in pins and back-end-of-line (BEOL). Results show that A7 3.5T CFET designs reach -46% area and iso-performance compared to N2 nanosheet designs.
dc.description.wosFundingTextThis work has been enabled in part by the NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union's Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania. For more information, visit nanoic-project.eu.
dc.identifier.doi10.1109/iedm50572.2025.11353539
dc.identifier.isbn979-8-3315-6786-6
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59846
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedate2025-12-06
dc.source.conferencelocationSan Francisco
dc.source.journal2025 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, IEDM
dc.source.numberofpages4
dc.title

3.5T CFET Block-Level DTCO for Superior PPA in A7 Node by Split Power, hDR Cells, Optimized Pins and BEOL

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-07-14
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-07-14
Files
Publication available in collections: