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Lithography options and challenges for sub-45nm node interconnect layers

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dc.contributor.authorMaenhoudt, Mireille
dc.date.accessioned2021-10-17T08:37:51Z
dc.date.available2021-10-17T08:37:51Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14085
dc.source.beginpage70
dc.source.conference11th IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate1/06/2008
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage72
dc.title

Lithography options and challenges for sub-45nm node interconnect layers

dc.typeProceedings paper
dspace.entity.typePublication
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