Publication:

The effect of pad structuring on CMP performance

Date

1999
Proceedings Paper
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dc.contributor.authorDevriendt, Katia
dc.contributor.authorVrancken, Evi
dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeylen, Nancy
dc.contributor.authorFyen, Wim
dc.contributor.authorHeyns, Marc
dc.contributor.authorChung, A.
dc.contributor.authorHsu, O.
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-06T11:04:11Z
dc.date.available2021-10-06T11:04:11Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3417
dc.source.beginpage227
dc.source.conferenceProceedings of the 4th International Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference - CMP-MIC
dc.source.conferencedate10/02/1999
dc.source.conferencelocationSanta Clara, CA USA
dc.title

The effect of pad structuring on CMP performance

dc.typeProceedings paper
dspace.entity.typePublication
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