Publication:

Automation of DfT for 3-D stacked die

Date

2011
Proceedings Paper
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dc.contributor.authorBeyne, Eric
dc.contributor.authorKonijnenburg, Mario
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorJensen, Lisa
dc.contributor.authorDeutsch, Sergej
dc.contributor.authorChikermane, Vivek
dc.contributor.authorKeller, Brion
dc.contributor.authorMukherjee, Subhasish
dc.contributor.authorGoel, Sandeep
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorKonijnenburg, Mario
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecKonijnenburg, Mario::0000-0001-8016-0888
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.accessioned2021-10-19T12:35:32Z
dc.date.available2021-10-19T12:35:32Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18578
dc.source.conference3-D Architectures for Semiconductor Integration and Packaging, 3-D ASIP
dc.source.conferencedate12/12/2011
dc.source.conferencelocationBurlingame, CA USA
dc.title

Automation of DfT for 3-D stacked die

dc.typeProceedings paper
dspace.entity.typePublication
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