Publication:

The influence of packaging materials on RF performance

Date

2003
Journal article
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dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorBrebels, Steven
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-15T04:07:50Z
dc.date.available2021-10-15T04:07:50Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7304
dc.source.beginpage351
dc.source.endpage357
dc.source.issue3
dc.source.journalMicroelectronics Reliability
dc.source.volume43
dc.title

The influence of packaging materials on RF performance

dc.typeJournal article
dspace.entity.typePublication
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