Publication:
Simulation of solder joint reliability for CBGA packages
Date
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Christiaens, Filip | |
| dc.contributor.author | Roose, Erik | |
| dc.contributor.author | Corlatan, D. | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T16:49:25Z | |
| dc.date.available | 2021-10-14T16:49:25Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5232 | |
| dc.source.beginpage | 360 | |
| dc.source.conference | Proceedings 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Strasbourg, France. | |
| dc.source.conferencelocation | ||
| dc.source.endpage | 364 | |
| dc.title | Simulation of solder joint reliability for CBGA packages | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |