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Conference contributions
Study morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps
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Study morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps
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Date
2016
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32702.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Preter, Inge
;
Derakhshandeh, Jaber
;
Rebibis, Kenneth June
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
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1832
since deposited on 2021-10-23
1
last month
Acq. date: 2025-12-16
Citations