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Il packaging dei dispositivi GaN-on-Si

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dc.contributor.authorLa Manna, Antonio
dc.contributor.authorLimaye, Paresh
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T15:06:31Z
dc.date.available2021-10-19T15:06:31Z
dc.date.issued2011-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19224
dc.source.beginpage56
dc.source.endpage58
dc.source.issueGennaio
dc.source.journalPCB Magazine
dc.title

Il packaging dei dispositivi GaN-on-Si

dc.typeJournal article
dspace.entity.typePublication
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