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Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive

Date

2012
Proceedings Paper
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dc.contributor.authorNagar, Magi
dc.contributor.authorRadisic, Alex
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-20T13:46:44Z
dc.date.available2021-10-20T13:46:44Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21184
dc.source.beginpage99
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene and Electronics Packaging
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
dc.source.endpage110
dc.title

Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive

dc.typeProceedings paper
dspace.entity.typePublication
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