Publication:

Low temperature flip chip attachment for flexible display applications

Date

2004
Proceedings Paper
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dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorMäättänen, Jarmo
dc.contributor.authorPodprocky, Tomas
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-15T17:19:36Z
dc.date.available2021-10-15T17:19:36Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9808
dc.source.beginpage307
dc.source.conferenceInternational Conference on Electronics Packaging - ICEP
dc.source.conferencedate14/04/2004
dc.source.conferencelocationTokyo Japan
dc.source.endpage312
dc.title

Low temperature flip chip attachment for flexible display applications

dc.typeProceedings paper
dspace.entity.typePublication
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