Publication:

Through-silicon via technology for 3D applications

Date

2009
Meeting abstract
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dc.contributor.authorPhilipsen, Harold
dc.contributor.authorLuhn, Ole
dc.contributor.authorCivale, Yann
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-18T01:41:59Z
dc.date.available2021-10-18T01:41:59Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16016
dc.source.beginpage2175
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.title

Through-silicon via technology for 3D applications

dc.typeMeeting abstract
dspace.entity.typePublication
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