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Active and passive component embedding into low-cost plastic substrates aimed at smart system application

Date

2013
Proceedings Paper
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dc.contributor.authorCauwe, Maarten
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorDe Baets, Johan
dc.contributor.authorvan den Brand, Jeroen
dc.contributor.authorKusters, Roel
dc.contributor.authorSridhar, Ashok
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.accessioned2021-10-21T06:53:07Z
dc.date.available2021-10-21T06:53:07Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22106
dc.source.conferenceInternational Microelectronics Assembly and Packaging Society - IMAPS US
dc.source.conferencedate1/10/2013
dc.source.conferencelocationOrlando, FL USA
dc.title

Active and passive component embedding into low-cost plastic substrates aimed at smart system application

dc.typeProceedings paper
dspace.entity.typePublication
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