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Metal-bonded, hermetic 0-level package for MEMS

Date

2010
Proceedings Paper
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dc.contributor.authorPham, Nga
dc.contributor.authorLimaye, Paresh
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCherman, Vladimir
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorTilmans, Harrie
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned2021-10-18T20:18:15Z
dc.date.available2021-10-18T20:18:15Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17804
dc.source.beginpage1
dc.source.conferenceElectronics Packaging Technology Conference - EPTC
dc.source.conferencedate8/12/2010
dc.source.conferencelocationSingapore Singapore
dc.source.endpage6
dc.title

Metal-bonded, hermetic 0-level package for MEMS

dc.typeProceedings paper
dspace.entity.typePublication
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