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K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries
Publication:
K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries
Date
2008
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Nagar, Magi
;
Vaes, Jan
;
Ein Eli, Yair
Journal
Abstract
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2026
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
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Views
2026
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations