Publication:

Overview of scalable transfer approaches to enable epitaxial 2D material integration

Date

2023
Proceedings Paper
https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134381
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dc.contributor.authorBrems, Steven
dc.contributor.authorGhosh, Souvik
dc.contributor.authorSmets, Quentin
dc.contributor.authorBoulon, Marie-Emmanuelle
dc.contributor.authorBoelen, Andries
dc.contributor.authorKennes, Koen
dc.contributor.authorTsai, Hung-Chieh
dc.contributor.authorChancerel, Francois
dc.contributor.authorMerckling, Clement
dc.contributor.authorWyndaele, Pieter-Jan
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorSchram, Tom
dc.contributor.authorKumar, Pawan
dc.contributor.authorSergeant, Stefanie
dc.contributor.authorNuytten, Thomas
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorMedina Silva, Henry
dc.contributor.authorGroven, Benjamin
dc.contributor.authorMorin, Pierre
dc.contributor.authorKar, Gouri Sankar
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorGhosh, Souvik
dc.contributor.imecauthorSmets, Quentin
dc.contributor.imecauthorBoulon, Marie-Emmanuelle
dc.contributor.imecauthorBoelen, Andries
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorTsai, Hung-Chieh
dc.contributor.imecauthorChancerel, Francois
dc.contributor.imecauthorMerckling, Clement
dc.contributor.imecauthorWyndaele, Pieter-Jan
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorKumar, Pawan
dc.contributor.imecauthorSergeant, Stefanie
dc.contributor.imecauthorNuytten, Thomas
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorGroven, Benjamin
dc.contributor.imecauthorMorin, Pierre
dc.contributor.imecauthorKar, Gouri Sankar
dc.contributor.imecauthorYudistira, Didit
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecSmets, Quentin::0000-0002-2356-5915
dc.contributor.orcidimecBoulon, Marie-Emmanuelle::0000-0003-1837-0803
dc.contributor.orcidimecTsai, Hung-Chieh::0000-0001-6654-4885
dc.contributor.orcidimecChancerel, Francois::0000-0003-4512-1634
dc.contributor.orcidimecMerckling, Clement::0000-0003-3084-2543
dc.contributor.orcidimecWyndaele, Pieter-Jan::0000-0003-4010-8377
dc.contributor.orcidimecde Marneffe, Jean-Francois::0000-0001-5178-6670
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecKumar, Pawan::0000-0002-5764-2915
dc.contributor.orcidimecSergeant, Stefanie::0000-0001-9923-0903
dc.contributor.orcidimecNuytten, Thomas::0000-0002-5921-6928
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecGroven, Benjamin::0000-0002-5781-7594
dc.contributor.orcidimecMorin, Pierre::0000-0002-4637-496X
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecAsselberghs, Inge::0000-0001-8371-3222
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBoelen, Andries::0000-0002-5380-7348
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.date.accessioned2023-11-28T13:34:32Z
dc.date.available2023-07-28T17:39:46Z
dc.date.available2023-11-28T13:34:32Z
dc.date.issued2023
dc.description.wosFundingTextThis work is supported by the Imec IIAP core CMOS program and received funding from the European Union's Graphene Flagship grant agreement CORE 3 (No 881603) and 2D-EPL (No. 952792).
dc.identifier.doi10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134381
dc.identifier.eisbn979-8-3503-3416-6
dc.identifier.issnna
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42225
dc.publisherIEEE
dc.source.conferenceInternational VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)
dc.source.conferencedateAPR 17-20, 2023
dc.source.conferencelocationHsinchu
dc.source.journalna
dc.source.numberofpages2
dc.title

Overview of scalable transfer approaches to enable epitaxial 2D material integration

dc.typeProceedings paper
dspace.entity.typePublication
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