Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
Publication:
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
Date
1999
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
3584.pdf
361.42 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Hua
;
Heyvaert, Ilse
;
Sing, Jin
;
Lanckmans, Filip
;
Brijs, Bert
;
Bender, Hugo
;
Maex, Karen
;
Froyen, L.
Journal
Abstract
Description
Metrics
Views
1946
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1946
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations