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Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
Publication:
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
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Date
1999
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Hua
;
Heyvaert, Ilse
;
Sing, Jin
;
Lanckmans, Filip
;
Brijs, Bert
;
Bender, Hugo
;
Maex, Karen
;
Froyen, L.
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1948
since deposited on 2021-10-14
Acq. date: 2026-01-09
Citations
Metrics
Views
1948
since deposited on 2021-10-14
Acq. date: 2026-01-09
Citations