Publication:

Hermetically sealed on-chip packaging of MEMS devices

Date

2000
Proceedings Paper
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dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorLabie, Riet
dc.contributor.authorBeerten, Steven
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T12:49:10Z
dc.date.available2021-10-14T12:49:10Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4269
dc.source.beginpage67
dc.source.conferenceProceedings European Space Components Conference - ESCCON
dc.source.conferencedate21/03/2000
dc.source.conferencelocationNoordwijk The Netherlands
dc.source.endpage69
dc.title

Hermetically sealed on-chip packaging of MEMS devices

dc.typeProceedings paper
dspace.entity.typePublication
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