Publication:
III-V on a Si platform for the next generations of communication systems
| dc.contributor.author | Parvais, Bertrand | |
| dc.contributor.author | Vais, Abhitosh | |
| dc.contributor.author | Yadav, Sachin | |
| dc.contributor.author | Mols, Yves | |
| dc.contributor.author | Vermeersch, Bjorn | |
| dc.contributor.author | Vondkar Kodandarama, Komal | |
| dc.contributor.author | Boccardi, Guillaume | |
| dc.contributor.author | Kunert, Bernardette | |
| dc.contributor.author | Collaert, Nadine | |
| dc.contributor.imecauthor | Parvais, Bertrand | |
| dc.contributor.imecauthor | Vais, Abhitosh | |
| dc.contributor.imecauthor | Yadav, Sachin | |
| dc.contributor.imecauthor | Mols, Yves | |
| dc.contributor.imecauthor | Vermeersch, Bjorn | |
| dc.contributor.imecauthor | Vondkar Kodandarama, Komal | |
| dc.contributor.imecauthor | Boccardi, Guillaume | |
| dc.contributor.imecauthor | Kunert, Bernardette | |
| dc.contributor.imecauthor | Collaert, Nadine | |
| dc.contributor.orcidimec | Parvais, Bertrand::0000-0003-0769-7069 | |
| dc.contributor.orcidimec | Vais, Abhitosh::0000-0002-0317-7720 | |
| dc.contributor.orcidimec | Yadav, Sachin::0000-0003-4530-2603 | |
| dc.contributor.orcidimec | Mols, Yves::0000-0002-7072-0113 | |
| dc.contributor.orcidimec | Vermeersch, Bjorn::0000-0001-8640-672X | |
| dc.contributor.orcidimec | Boccardi, Guillaume::0000-0003-3226-4572 | |
| dc.contributor.orcidimec | Kunert, Bernardette::0000-0002-8986-4109 | |
| dc.contributor.orcidimec | Collaert, Nadine::0000-0002-8062-3165 | |
| dc.date.accessioned | 2022-11-15T10:23:48Z | |
| dc.date.available | 2022-09-22T02:50:30Z | |
| dc.date.available | 2022-11-15T10:23:48Z | |
| dc.date.issued | 2022 | |
| dc.identifier.doi | 10.1109/EDTM53872.2022.9798159 | |
| dc.identifier.eisbn | 978-1-6654-2178-2 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40479 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 250 | |
| dc.source.conference | 6th IEEE Electron Devices Technology and Manufacturing Conference (EDTM) | |
| dc.source.conferencedate | MAR 06-09, 2022 | |
| dc.source.conferencelocation | Oita, Japan | |
| dc.source.endpage | 252 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 3 | |
| dc.subject.keywords | INTEGRATION | |
| dc.title | III-V on a Si platform for the next generations of communication systems | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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