Publication:

Plasmonic properties of silicon nitride encapsulated copper

Date

2024
Journal article
https://doi.org/10.1364/OME.524159
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dc.contributor.authorSun, Conglin
dc.contributor.authorGolshani, Negin
dc.contributor.authorVerheyen, Peter
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorBrahim, Kamal
dc.contributor.authorMafakheri, Erfan
dc.contributor.authorHuang, Yishu
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorCatthoor, Francky
dc.contributor.authorLin, Dennis
dc.contributor.authorVan Dorpe, Pol
dc.contributor.authorHaffner, Christian
dc.contributor.imecauthorSun, Conglin
dc.contributor.imecauthorGolshani, Negin
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorBrahim, Kamal
dc.contributor.imecauthorMafakheri, Erfan
dc.contributor.imecauthorHuang, Yishu
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorLin, Dennis
dc.contributor.imecauthorVan Dorpe, Pol
dc.contributor.imecauthorHaffner, Christian
dc.contributor.orcidimecGolshani, Negin::0000-0002-1299-0641
dc.contributor.orcidimecVerheyen, Peter::0000-0002-8245-9442
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecVan De Peer, Myriam::0009-0008-6571-4166
dc.contributor.orcidimecBrahim, Kamal::0000-0002-8687-8302
dc.contributor.orcidimecMafakheri, Erfan::0000-0003-2822-8624
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecLin, Dennis::0000-0002-1577-6050
dc.contributor.orcidimecVan Dorpe, Pol::0000-0003-0918-1664
dc.contributor.orcidimecHaffner, Christian::0000-0002-8947-5293
dc.date.accessioned2025-06-23T08:57:21Z
dc.date.available2024-11-24T16:40:19Z
dc.date.available2025-06-23T08:57:21Z
dc.date.embargo9999-12-31
dc.date.issued2024
dc.identifier.doi10.1364/OME.524159
dc.identifier.issn2159-3930
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44837
dc.publisherOptica Publishing Group
dc.source.beginpage2800
dc.source.endpage2807
dc.source.issue11
dc.source.journalOPTICAL MATERIALS EXPRESS
dc.source.numberofpages8
dc.source.volume14
dc.subject.keywordsINTRABAND OPTICAL CONDUCTIVITY
dc.subject.keywordsDIFFUSION BARRIER
dc.subject.keywordsCU
dc.subject.keywordsSURFACE
dc.subject.keywordsRESISTIVITY
dc.subject.keywordsPERFORMANCE
dc.subject.keywordsFILMS
dc.subject.keywordsAG
dc.title

Plasmonic properties of silicon nitride encapsulated copper

dc.typeJournal article
dspace.entity.typePublication
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