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Articles
Modelling complex via hole structures
Publication:
Modelling complex via hole structures
Date
2002
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Laermans, E.
;
De Geest, J.
;
De Zutter, Daniel
;
Olyslager, Frank
;
Sercu, S.
;
Morlion, D.
Journal
IEEE Trans. Advanced Packaging
Abstract
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1939
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1939
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations