Publication:

Reliability concerns in copper TSV's: methods and results

Date

2012-07
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorCroes, Kristof
dc.contributor.authorCherman, Vladimir
dc.contributor.authorLi, Yunlong
dc.contributor.authorZhao, Larry
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorCivale, Yann
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorStucchi, Michele
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorDimcic, Biljana
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.date.accessioned2021-10-20T10:25:38Z
dc.date.available2021-10-20T10:25:38Z
dc.date.issued2012-07
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20511
dc.source.conference19th International Symposium on the Physical & Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate2/07/2012
dc.source.conferencelocationSingapore
dc.title

Reliability concerns in copper TSV's: methods and results

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions