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Wafer level high density 3D integration technologies for space applications

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dc.contributor.authorDe Moor, Piet
dc.contributor.authorDe Munck, Koen
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-16T15:32:10Z
dc.date.available2021-10-16T15:32:10Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11962
dc.source.conference6th Round Table on Micro/Nano Technologies for Space
dc.source.conferencedate8/10/2007
dc.source.conferencelocationESTEC - Noordwijk Te Netherlands
dc.title

Wafer level high density 3D integration technologies for space applications

dc.typeOral presentation
dspace.entity.typePublication
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